Description: BGA rework, BGA reballing, component tinning, pad repair, x-ray inspection, modifications, jumper wires, circuitry repair, component-level modification.
Keywords: BGA component, surface mount, BGA pad repair, x-ray inspection, ECO, modifications, jumper wires, circuitry repair, component rework, base board repair.
Science Technology Electronics Repair 网站
2024年12月30日